HKSTP partners with Plug and Play in calling global startups for EPiC 2023

Albert Wong, Chief Executive Officer at HKSTP

Hong Kong Science and Technology Parks Corporation (HKSTP) has partnered with global innovation platform, Plug and Play, to call on ambitious startups and entrepreneurs to join the seventh Elevator Pitch Competition 2023 (EPiC 2023), one of the biggest pitch events in Hong Kong. The final entry deadline for the Competition has been extended to January 20th.

What does the elevator competition mean for startups?

This offers startups the chance to join the combined Hong Kong Science and Technology Parks Corporation (HKSTP) and Plug and Play eco-systems to launch their innovations onto the global stage. Interested parties on two technology tracks (FinTech and PropTech) only need to submit a 2-min video introduction to make a potentially life-changing decision.

50 shortlisted semi-finalists will have the golden opportunity to be considered by HKSTP Venture Fund for direct investment of up to $5 million as well as market expansion support in Asia and beyond, plus the chance to win a cash prize of $60,000 if crowned champion.

As the world’s leading accelerator, Plug and Play will leverage its global network to organise international competitions in Asia, Europe and Northern America throughout February to bring in overseas startups to the April final in Hong Kong. Hong Kong provides the ideal platform to expand into the vast Asian market, being a gateway to both Mainland China and Asia.

Startups joining EPiC 2023 can fully leverage the largest I&T ecosystem in Hong Kong and HKSTP’s direct connections to over 1,000 investors and more than 300 corporate partners.

Who can apply:

  • Tech startups that are less than 10 years old
  • Ideas should focus on one of the TWO technology tracks: FinTech and PropTech

What does this mean for HKSTP and Plug and Play?

Albert Wong, Chief Executive Officer of HKSTP, said: “This year, our flagship event EPiC is set to be the biggest and best-ever as we partner with world-renowned Plug and Play, elevating the investment platform to a truly global level. This collaboration cements HKSTP and Hong Kong as a unique global launchpad to rapidly scale up innovators on their growth journey, while achieving our mission to propel success and advance Hong Kong’s I&T development.”

Saeed Amidi, Chief Executive Officer of Plug and Play

Saeed Amidi, Chief Executive Officer of Plug and Play, said: “Partnering with HKSTP on EPiC is a major step forward in our mission to harness the huge Asia opportunity to build the world’s leading innovation platform. We are partnering with changemakers like HKSTP to build a unique innovation ecosystem by connecting the brightest minds with world-leading corporations, VC firms, universities, and government agencies across multiple industries.’’

EPiC 2023 will take place at the iconic sky100 venue atop Hong Kong’s tallest building, International Commerce Centre, to create a genuine elevator pitch experience for startups.

Applications close on 20 January at 23:59 (Hong Kong time). Visit the website for more.